Controlling contamination in fluids has concerned semiconductor device manufacturers for years. It is well known that chemical impurities and particulate contaminates on the wafer surface affect device performance and circuit yield. Effective techniques for wafer cleaning have been fueled by process demands of shirking geometry and greater yields. This has pushed the critical manufacturing to their limits. Today's escalating semiconductor manufacturing process demands innovative solutions to maintain the stringent requirements of ultra pure process chemicals. At IN-FLO Designs, we have been solving fluid handling problems that have already been encountered in manufacturing processes.
